The TMC Development Center -abbreviated by ‘TDC’ (TMC Development Center) throughout the rest of the document i-s located at:

Floor 1 and 4, Building B1, Zhongguancun Dongsheng Science and Technology Park, 66 XiXiaokou Road, Haidian District, Beijing, China

The following services and processes provided by TDC are in the scope of the evaluation process:

• Security IC software and hardware design and development, layout data such as GDS file formulation and sending to wafer foundry.
• IC embedded software development, management, storage and shipment.
• Sample receiving, management, storage and shipment.
• (In some rare cases) Enciphered IC embedded software (Chip OS, termed as COS) receiving, management, storage. CP/FT (Final test) testing program/instruction formulation, management, storage and delivered to CP testing site and packaging site.
• CP/FT testing result receiving, management and storage.
• Production data (such as COS downloading/testing, Personalization production/testing vector, production instruction, etc.) formulation and sending to packaging site and card manufacture.
• Product User Manual (IC and COS) formulation and sending to customer.